DCDPS (4,4′-Dichlorodiphenyl Sulfone/ Bis(4-chlorophenyl) sulphone CAS No. 80-07-9 )
4,4′-Dichlorodiphenyl Sulfone
Bis(4-chlorophenyl) sulphone
CAS No. 80-07-9
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N,N,N‘N‘-Tetrakis (2-hydroxyethyl) ethylenediamine
THEED
CAS No. 140-07-8
Chemical Name: N,N,N‘N‘-Tetrakis (2-hydroxyethyl) ethylenediamine
Code: THEED
CAS No.: 140-07-8
HS CODE: 2921219000
Type: purity 80%, 98%
Product Description
THEED(Tetrahydroxyethyl ethylenediamine), full name: N,N,N',N'-tetrakis(2-hydroxyethyl)ethylenediamine, CAS No.: 140-07-8.
It is a multifunctional water-soluble organic amine containing four hydroxyl groups and two tertiary amine groups, synthesized by the addition reaction of ethylenediamine and ethylene oxide.
Product properties & Features
1. Solubility and acidity-basicity:
Highly soluble in water and miscible with water in any proportion. It is also miscible with alcohols and most organic solvents with excellent compatibility.
2. Structure and reactivity:
The molecule contains four hydroxyl (—OH) groups and two tertiary amine groups. It possesses complexing, crosslinking and catalytic activities, and can undergo esterification, etherification, condensation and other reactions with mild and controllable reaction conditions.
3. Complexing and dispersing performance:
It has strong metal complexing ability and can form stable water-soluble complexes with copper, nickel, iron and other metal ions. With good dispersibility, it is suitable for metal surface treatment and water treatment systems.
4. Compatibility and stability:
It has excellent compatibility with resins, rubber, coatings and additives. It is stable at room temperature, hydrolysis-resistant, aging-resistant and with long storage life.
Applications
Electroplating and PCB industry:
Used as a high-efficiency metal complexing agent for alkaline zinc-nickel alloy electroplating and PCB electroless copper plating. Its stability is superior to EDTA, improving the uniformity and adhesion of coating layers.
It is also applied in soldering flux and cleaning agent formulations.
Polymer materials:
Serves as epoxy resin curing agent and modifier to improve flexibility, adhesion and water resistance. Used as crosslinking agent and catalyst in the synthesis of polyurethane and rubber to enhance elasticity and structural stability
also applied in antistatic agents and water-based coating additives.
Construction materials:
Used as cement early-strength agent and water reducer. It accelerates hydration reaction, shortens the strength development cycle within 1–3 days, and performs remarkably well in low-temperature construction. It improves the fluidity, strength and durability of concrete, suitable for precast components and winter construction.
Water treatment and daily chemicals:
Used as metal ion complexing agent and dispersant for heavy metal removal in industrial wastewater and scale inhibition in circulating water systems. In daily chemicals, it acts as pH buffer and chelating agent to stabilize formulations and improve product stability.
Fine chemicals and other fields:
Applied as pesticide and pharmaceutical intermediates, desulfurizer for petrochemical industry, and slow-release agent for chemical fertilizers.
It is also used in ink, antibacterial care solution, chromatographic stationary phase, as well as ligand and carrier for catalytic reactions.
Packing & Storage
25kg or 200kg/barrel, or 1000kg/IBC TANK
Technical Index
| Item | Index |
| Appearance | Colorless to pale yellow viscous liquid |
| Content, % | ≥98 |
| PH value(1% aqueous solution) | 10.0-12.0 |
| Color, Pt-Co | ≤50 |
| Solubility | Miscible with water in any ratio |
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